Sr Principal Sourcing Manager – Silicon Technologies

The posting, as Astera Labs wrote it

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .

Role Overview

Astera Labs is seeking a highly experienced Sr. Principal – Technical Category Sourcing Manager – OSAT & Substrate to set and drive global sourcing strategy in partnership with Engineering—owning supplier selection, commercial negotiations, and product cost models across our outsourced semiconductor assembly and test (OSAT), advanced packaging, and package substrate supply base.

This role owns the end-to-end commercial relationship with OSAT partners, substrate suppliers, and their sub-tier raw material sources—from sourcing strategy and RFQ through pricing, contracting, capacity assurance, and cost roadmaps—across advanced packaging platforms including flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, and high-layer-count ABF substrates.

This is a highly cross-functional role working closely with Package Engineering, Test Engineering, Operations, Quality, Finance, and Legal to secure capacity, qualify new suppliers, and deliver cost and supply-continuity commitments through NPI and high-volume production.

A core focus of this role is staying ahead of the technology pipeline: as our silicon moves to advanced process nodes and increasingly complex multi-chip packages, you will secure the assembly, test, and substrate capability—and the sub-tier raw materials behind it—well before those platforms reach production.

Success in this role requires a strong balance of technical acumen, business savvy, and the ability to execute against strategic objectives—translating engineering requirements into sourcing decisions, and sourcing strategy into measurable cost, capacity, and continuity outcomes.

A Day in the Life

In this role, you will

• Set and drive global sourcing strategy for OSAT, advanced packaging, and substrates in partnership with Engineering
• Lead RFQs, pricing negotiations, and commercial agreements with OSAT and substrate partners
• Secure capacity, tooling, and NRE commitments ahead of demand inflection points
• Build and maintain product cost models and defend annual cost-reduction roadmaps
• Qualify and develop second-source suppliers to de-risk single-source packages
• Partner with Package and Test Engineering to sourc

[…]
otal-cost-of-ownership models

• Demonstrated balance of technical acumen and business judgment, with a track record of executing against multi-year strategic objectives
• Experience with ERP and procurement systems (e.g., SAP, Oracle, NetSuite) and sourcing processes (RFQ, award, supplier qualification)
• Excellent cross-functional communication and executive-level stakeholder management skills

Preferred Qualifications

• Advanced degree (MBA or MS in Engineering, Supply Chain, or Business)
• Experience in AI infrastructure, cloud hardware, or high-speed interconnect ecosystems
• Established relationships across the OSAT and substrate supplier base in Taiwan, Korea, Japan, China, and Southeast Asia
• Experience standing up new suppliers and qualifying second sources in a high-growth fabless environment
• Familiarity with advanced packaging cost drivers, substrate panel economics, and test-time reduction levers
• Exposure to emerging packaging platforms such as panel-level packaging, glass substrates, or co-packaged optics

Why Join Us?

• Own the OSAT, advanced packaging, and substrate category for mission-critical AI infrastructure silicon
• Play a central role in scaling the back-end supply base during a period of hyper growth
• Set the sourcing strategy for next-generation multi-chip packages alongside engineering, product, and operations leaders
• Operate in a fast-paced environment with high impact on cost, margin, and supply continuity
• Competitive compensation, equity, and benefits

Base salary range is $190,000 to $240,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.