Senior Staff Engineer, Thermal Simulation

The posting, as Samsung Semiconductor wrote it

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We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.

We are seeking a highly experience hands-on Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies. The ideal candidate will have a strong technical background in semiconductor packaging, advanced packaging, electronics cooling, or a related field, with demonstrated expertise in thermal simulation and analysis.

This role will work closely with Samsung customers and internal engineering customers and internal engineering teams to develop and optimize thermal solutions from early product through detailed modeling and design validation.

The successful candidate will collaborate extensively with cross functional and cross-cultural teams.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy with 10-20% of domestic and international travel.

Reports to: Thermal/Mechanical Simulation Manager

What You’ll Do

• Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
• Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing.
• Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.
• Analyze simulation and measurement results to enhance product reliability.
• Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.
• Translate customer requirements and thermal specifications into simulation methodologies.
• Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.
• Communicate technical findings clearly through engineering reports, presentations and customer reviews.
• Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power

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